Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
- Redaktör
- John W. Balde
- Upplaga
- Softcover reprint of the original 1st ed. 2003
- ISBN
- 9781461349778
- Språk
- Engelska
- Vikt
- 310 gram
- Utgivningsdatum
- 2014-02-23
- Sidor
- 347