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Foldable Flex and Thinned Silicon Multichip Packaging Technology
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Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

Redaktör
John W. Balde
Upplaga
Softcover reprint of the original 1st ed. 2003
ISBN
9781461349778
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
2014-02-23
Sidor
347