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Electrical Design of Through Silicon Via
Spara

Electrical Design of Through Silicon Via

Engelska
This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
Upplaga
Softcover reprint of the original 1st ed. 2014
ISBN
9789401779494
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
27.9.2016
Förlag
Springer
Sidor
280