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Electrical Design of Through Silicon Via

engelska
129,70 €

This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.

ISBN
9789401779494
Språk
engelska
Vikt
281 gram
Utgivningsdatum
27.9.2016
Förlag
Springer
Sidor
280