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Die-stacking Architecture
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Die-stacking Architecture

The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
Författare
Yuan Xie, Jishen Zhao
ISBN
9783031006197
Språk
Engelska
Vikt
310 gram
Utgivningsdatum
10.6.2015
Sidor
113