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Arbitrary Modeling of TSVs for 3D Integrated Circuits
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Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
ISBN
9783319076102
Språk
Engelska
Vikt
446 gram
Utgivningsdatum
2014-09-05
Sidor
179