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3D Stacked Chips
häftad, 2018
Engelska
64,40 €
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
- Undertitel
- From Emerging Processes to Heterogeneous Systems
- Redaktör
- Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
- Upplaga
- Softcover reprint of the original 1st ed. 2016
- ISBN
- 9783319793054
- Språk
- Engelska
- Vikt
- 310 gram
- Utgivningsdatum
- 2018-05-26
- Sidor
- 339
