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3D Interconnect Architectures for Heterogeneous Technologies
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3D Interconnect Architectures for Heterogeneous Technologies

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

Undertitel
Modeling and Optimization
Upplaga
2022 ed.
ISBN
9783030982287
Språk
Engelska
Vikt
446 gram
Utgivningsdatum
2022-06-28
Sidor
395