Filter
Sökt på: Sökresultat
Filter
totalt 2 träffar
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
inbunden,
2024,
Engelska,
ISBN 9789819721399
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering …
Chiplet Design and Heterogeneous Integration Packaging
häftad,
2024,
Engelska,
ISBN 9789811999192
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice …