Rajaa
Hakutulokset: 9780471594468
Rajaa
yksi hakutulos.
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
sidottu,
1994,
englanti,
ISBN 9780471594468
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and …